I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

Comprehensive study on effect of chip layout and mold thick..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lim, Sharon Pei Siang ; Chong, Ser Choong ; Seit, Wen Wei... - p. 945-950 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013169