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Novel integration scheme to pattern low cost sub-100nm dime..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Paneri, Abhilash ; Cummins, Cian ; Saseendran, Sandeep S. - p. 542-545 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013171