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Sub $1\ \mu \mathrm{m}$ Pitch Achievement for Cu/SiO2 Hybri..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Ayoub, Bassel ; Lhostis, Sandrine ; Moreau, Stephane... - p. 418-424 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013180