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1 Ergebnisse
1
Process Development of Via Formation by Laser Drilling on I..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Cereno, Daniel Ismael
;
Choong, Chong Ser
;
Hsiang-Yao, Hsiao
- p. 401-404 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013188
RT T1
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
: T1
Process Development of Via Formation by Laser Drilling on Insulating Resin
UL https://suche.suub.uni-bremen.de/peid=ieee-10013188&Exemplar=1&LAN=DE A1 Cereno, Daniel Ismael A1 Choong, Chong Ser A1 Hsiang-Yao, Hsiao YR 2022 K1 Drilling K1 Aluminum K1 Surface emitting lasers K1 Routing K1 Resins K1 Gas lasers K1 Reliability SP 401 OP 404 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013188 DO https://doi.org/10.1109/EPTC56328.2022.10013188 SF ELIB - SuUB Bremen
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