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1 Ergebnisse
1
Molecular Dynamics Study on Plasma-Surface Interactions of ..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Hahn, Seung Ho
;
Kim, Wooyoung
;
Shin, Donggap
... - p. 527-533 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013205
RT T1 <cTitle>2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Molecular Dynamics Study on Plasma-Surface Interactions of SiCN Dielectrics for Wafer-to-Wafer Hybrid Bonding Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10013205&Exemplar=1&LAN=DE A1 Hahn, Seung Ho A1 Kim, Wooyoung A1 Shin, Donggap A1 Lee, Yongin A1 Choi, Wonyoung A1 Moon, Bumki A1 Lim, Kyeonbin A1 Rhee, Minwoo YR 2022 K1 Three-dimensional displays K1 Surface roughness K1 Time measurement K1 Surface structures K1 Rough surfaces K1 Dielectrics K1 Plasmas SP 527 OP 533 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013205 DO https://doi.org/10.1109/EPTC56328.2022.10013205 SF ELIB - SuUB Bremen
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