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SiC Fan-out Wafer Level Package for High Power Application:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Mackowiak, Piotr ; Wittler, Olaf ; Braun, Tanja... - p. 104-108 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013212