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Investigation of Au-AuSn Bonding Below Eutectic Temperature..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chen, Daniel S.H. ; Wai, Eva L.C. ; Yeo, Yi Xuan... - p. 315-320 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013215