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Design and Optimization of Microchannel in a Fan-out Packag..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Sun, Bo ; Zhang, Weize ; Guo, Chunbing. - p. 885-889 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013216