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1 Ergebnisse
1
Parametric study on relevant design and material parameters..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Sprenger, Mario
;
Noll, Niklas
;
Hecht, Christoph
... - p. 660-667 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013218
RT T1
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
: T1
Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules
UL https://suche.suub.uni-bremen.de/peid=ieee-10013218&Exemplar=1&LAN=DE A1 Sprenger, Mario A1 Noll, Niklas A1 Hecht, Christoph A1 de Greiff, Malte A1 Muller, Lars A1 Franke, Jorg YR 2022 K1 Encapsulation K1 Heating systems K1 Young's modulus K1 Thermal expansion K1 Thermomechanical processes K1 Multichip modules K1 Materials reliability SP 660 OP 667 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013218 DO https://doi.org/10.1109/EPTC56328.2022.10013218 SF ELIB - SuUB Bremen
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