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Fault Isolation for Board-Level Solder Joint Failure Using ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chen, Y. Y. ; Liu, W. J. ; Zou, Y. S.... - p. 795-798 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013229