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1 Ergebnisse
1
Novel CMP Material Solution To Enable High Removal Rate Die..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Chakraborty, Tapash
;
Verhaverbeke, Steven
;
Chen, Han-Wen
. - p. 540-541 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013230
RT T1 <cTitle>2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Novel CMP Material Solution To Enable High Removal Rate Dielectric CMP For Hybrid Bonding Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10013230&Exemplar=1&LAN=DE A1 Chakraborty, Tapash A1 Verhaverbeke, Steven A1 Chen, Han-Wen A1 Chandran, Gopi YR 2022 K1 Solvents K1 Packaging K1 Surface roughness K1 Silicon K1 Surface topography K1 Rough surfaces K1 Dielectrics SP 540 OP 541 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013230 DO https://doi.org/10.1109/EPTC56328.2022.10013230 SF ELIB - SuUB Bremen
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