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1 Ergebnisse
1
A non-destructive inspection method for electronic packagin..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Xiong, Chuanguo
;
Zeng, Baoshan
;
Huang, Yuhua
. - p. 719-724 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013236
RT T1 <cTitle>2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>A non-destructive inspection method for electronic packaging reliability incorporating mechanical and thermal information</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10013236&Exemplar=1&LAN=DE A1 Xiong, Chuanguo A1 Zeng, Baoshan A1 Huang, Yuhua A1 Zhu, Fulong YR 2022 K1 Temperature measurement K1 Surface contamination K1 Displacement measurement K1 Speckle K1 Inspection K1 Packaging K1 Electronic packaging thermal management SP 719 OP 724 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013236 DO https://doi.org/10.1109/EPTC56328.2022.10013236 SF ELIB - SuUB Bremen
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