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Establishment of Highly Dense Wire Bonding with Insulated A..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Jaafar, Norhanani Binte ; Choong, Chong Ser - p. 352-356 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013237