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1 Ergebnisse
1
Establishment of Highly Dense Wire Bonding with Insulated A..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Jaafar, Norhanani Binte
;
Choong, Chong Ser
- p. 352-356 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013237
RT T1
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
: T1
Establishment of Highly Dense Wire Bonding with Insulated Au Wire
UL https://suche.suub.uni-bremen.de/peid=ieee-10013237&Exemplar=1&LAN=DE A1 Jaafar, Norhanani Binte A1 Choong, Chong Ser YR 2022 K1 Temperature measurement K1 Gold K1 Semiconductor device measurement K1 Wires K1 Layout K1 Coatings K1 Bonding SP 352 OP 356 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013237 DO https://doi.org/10.1109/EPTC56328.2022.10013237 SF ELIB - SuUB Bremen
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