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1 Ergebnisse
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Reliability of lead-free solders for die attach in automoti..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Ottinger, Bettina
;
Holverscheid, Joshua
;
Konig, Sebastian
... - p. 409-413 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013246
RT T1 <cTitle>2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Reliability of lead-free solders for die attach in automotive power modules</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10013246&Exemplar=1&LAN=DE A1 Ottinger, Bettina A1 Holverscheid, Joshua A1 Konig, Sebastian A1 Jerichow, Edgar A1 Lunz, Sebastian A1 Sprenger, Mario A1 Muller, Lars A1 Goth, Christian A1 Franke, Jorg YR 2022 K1 Multichip modules K1 Fatigue K1 Intermetallic K1 Compounds K1 Microstructure K1 Copper K1 Reliability SP 409 OP 413 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013246 DO https://doi.org/10.1109/EPTC56328.2022.10013246 SF ELIB - SuUB Bremen
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