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Introducing novel "Rigid Carrier with Composite Release Lay..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),

Matsuura, Yoshinori ; Yoshida, Tatsuya ; Komiya, Yukiko... - p. 513-516 , 2022

Link: https://doi.org/10.1109/EPTC56328.2022.10013258

RT 
T1 <cTitle>2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Introducing novel "Rigid Carrier with Composite Release Layer" to assemble ultra-high density Advanced Packages & Substrates in wafer and panel format</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10013258&Exemplar=1&LAN=DE
				
A1 Matsuura, Yoshinori
A1 Yoshida, Tatsuya
A1 Komiya, Yukiko
A1 Nakamura, Toshimi
A1 Yanai, Takenori
A1 Okuyama, Kazuhiro
A1 Kuwahara, Kyohei
A1 Kitabatake, Yukiko
A1 Ishii, Rintaro
A1 Hayashi, Katsuyuki
A1 Kubota, Takashi
A1 Fujii, Joji
A1 Dutta, Vivek B.
YR 2022
K1 Costs
K1 Thermal resistance
K1 Force
K1 Glass
K1 Thermal force
K1 Electronic packaging thermal management
K1 Manufacturing
K1 Rigid carrier substrate
K1 Release layer
K1 Redistribution Layer (RDL)
K1 HRDP® (High Resolution Debondable Panel)
K1 Bonding-Debonding
K1 Wafer and Panel Level Package arrays
K1 Coreless Substrates
K1 Line/Space (L/S)
K1 Total thickness variation (TTV)
K1 Laser lift-off (LLO)
SP 513
OP 516
LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013258
DO https://doi.org/10.1109/EPTC56328.2022.10013258
SF ELIB - SuUB Bremen

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