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1 Ergebnisse
1
Lead-Free Solder Electroplating Chemical for New Market Sta..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Lim, Jeongmin
;
Lee, Wonhyun
;
Park, SeulA
... - p. 81-84 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013259
RT T1 <cTitle>2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Lead-Free Solder Electroplating Chemical for New Market Standards</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10013259&Exemplar=1&LAN=DE A1 Lim, Jeongmin A1 Lee, Wonhyun A1 Park, SeulA A1 Woo, SuHan A1 Choi, EunYul A1 Pokhrel, Ravi A1 Lee A1 Lee, DongWoo A1 Lee, Yilhak A1 Kim, Mieock YR 2022 K1 Electrochemical deposition K1 Industries K1 Silver K1 Lead K1 Packaging K1 Market research K1 Standards SP 81 OP 84 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013259 DO https://doi.org/10.1109/EPTC56328.2022.10013259 SF ELIB - SuUB Bremen
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