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Comparative Study of Die-Attach Materials for LED Die Bondi..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Hu, Liangxing ; Bao, Shuyu ; Wang, Yue... - p. 447-451 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013260