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1 Ergebnisse
1
Numerical Simulation for Flow Boiling in Microchannels with..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Hongying, Li
;
Lunsheng, Pan
;
Jing, Lou
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013261
RT T1
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
: T1
Numerical Simulation for Flow Boiling in Microchannels with Different Pin Fin Arrays
UL https://suche.suub.uni-bremen.de/peid=ieee-10013261&Exemplar=1&LAN=DE A1 Hongying, Li A1 Lunsheng, Pan A1 Jing, Lou A1 Xiaowu, Zhang A1 Ducvinh, Le A1 Ming, Cheng A1 Jun, Li A1 Wei, Kang Chang A1 Jien, Chui King A1 Huicheng, Feng YR 2022 K1 Heating systems K1 Solid modeling K1 Three-dimensional displays K1 Predictive models K1 Thermal management K1 Electronic packaging thermal management K1 Numerical simulation SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013261 DO https://doi.org/10.1109/EPTC56328.2022.10013261 SF ELIB - SuUB Bremen
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