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1 Ergebnisse
1
Stress-less Dicing Solution for Thin and Large Die Handling..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Park, Sunwoo
;
Kang, Sujie
;
Shin, YongChul
... - p. 183-186 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013271
RT T1 <cTitle>2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Stress-less Dicing Solution for Thin and Large Die Handling for 2.5D/3D IC Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10013271&Exemplar=1&LAN=DE A1 Park, Sunwoo A1 Kang, Sujie A1 Shin, YongChul A1 Hong, Nungpyo A1 Lee, Hyunjin A1 Lim, Kyungbin A1 Rhee, Minwoo A1 Jang, Juho A1 Oh, Jeongwon A1 Park, Sungsoo YR 2022 K1 Laser theory K1 Adhesives K1 Glass K1 Packaging K1 Sawing K1 Silicon K1 Chemical lasers SP 183 OP 186 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013271 DO https://doi.org/10.1109/EPTC56328.2022.10013271 SF ELIB - SuUB Bremen
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