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Chlorine and sulfur effects on copper-aluminum wire bond re..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lois, Liao Jinzhi ; Bisheng, Wang ; Xi, Zhang.. - p. 749-752 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013274