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1 Ergebnisse
1
Influence of Current Density on Wire Bond Lifetime in Activ..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Sippel, Marcel
;
Schmidt, Ralf
;
Kasbauer, Michael
... - p. 799-805 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013275
RT T1 <cTitle>2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Influence of Current Density on Wire Bond Lifetime in Active Power Cycling Test</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10013275&Exemplar=1&LAN=DE A1 Sippel, Marcel A1 Schmidt, Ralf A1 Kasbauer, Michael A1 Sprenger, Mario A1 Hensel, Alexander A1 Franke, Jorg YR 2022 K1 Geometry K1 Correlation K1 Temperature K1 Wires K1 Thermomechanical processes K1 Multichip modules K1 Reliability engineering SP 799 OP 805 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013275 DO https://doi.org/10.1109/EPTC56328.2022.10013275 SF ELIB - SuUB Bremen
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