I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

Ka-Band AiP Array in Mold-on-Mold FOWLP technology:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Mei, Sun ; Guan, Lim Teck ; Lin, Zhou... - p. 62-65 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013284