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Wafer Warpage Optimization Via Finite Element Analysis for ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Ji, Lin ; Chai, Tai Chong ; Siang Lim, Sharon Pei - p. 707-711 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013285