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An EIC on PIC packaging solution for photonic engine of 800..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Feng, Xu ; Guan, Lim Teck ; Lee, Wen. - p. 124-127 , 2022
Link: https://doi.org/10.1109/EPTC56328.2022.10013288