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1 Ergebnisse
1
Process Development of Fan-Out with Multi-layer RDL for Chi..:
, In:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
,
Hsiang-Yao, Hsiao
;
Soon Wee, David Ho
;
PS, Sharon Lim
- p. 89-93 , 2022
Link:
https://doi.org/10.1109/EPTC56328.2022.10013294
RT T1
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
: T1
Process Development of Fan-Out with Multi-layer RDL for Chiplets Packaging
UL https://suche.suub.uni-bremen.de/peid=ieee-10013294&Exemplar=1&LAN=DE A1 Hsiang-Yao, Hsiao A1 Soon Wee, David Ho A1 PS, Sharon Lim YR 2022 K1 Fabrication K1 Fans K1 Semiconductor lasers K1 Packaging K1 Market research K1 Ceramics K1 Wafer scale integration SP 89 OP 93 LK http://dx.doi.org/https://doi.org/10.1109/EPTC56328.2022.10013294 DO https://doi.org/10.1109/EPTC56328.2022.10013294 SF ELIB - SuUB Bremen
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