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3D Stackable Cryogenic InGaAs HEMT-Based DC and RF Multiple..:

, In: 2022 International Electron Devices Meeting (IEDM),
Jeong, Jaeyong ; Kim, Seong Kwang ; Kim, Jongmin... - p. 4.5.1-4.5.4 , 2022
Link: https://doi.org/10.1109/IEDM45625.2022.10019363