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Advanced System in Package Enabled by Wafer Level Heterogen..:

, In: 2022 International Electron Devices Meeting (IEDM),
Bhattacharya, S. ; Lim, T. G. ; Ho, D.... - p. 3.1.1-3.1.4 , 2022
Link: https://doi.org/10.1109/IEDM45625.2022.10019429