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3-Tier BSI CIS with 3D Sequential & Hybrid Bonding Enabling..:

, In: 2022 International Electron Devices Meeting (IEDM),

Guyader, F. ; Batude, P. ; Malinge, P.... - p. 37.4.1-37.4.4 , 2022

Link: https://doi.org/10.1109/IEDM45625.2022.10019432

RT 
T1 <cTitle>2022 International Electron Devices Meeting (IEDM)</cTitle>: T1 <Title>3-Tier BSI CIS with 3D Sequential & Hybrid Bonding Enabling a1.4um pitch,106dB HDR Flicker Free Pixel</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10019432&Exemplar=1&LAN=DE
				
A1 Guyader, F.
A1 Batude, P.
A1 Malinge, P.
A1 Vire, E.
A1 Lacord, J.
A1 Jourdon, J.
A1 Poulet, J.
A1 Gay, L.
A1 Ponthenier, F.
A1 Joblot, S.
A1 Farcy, A.
A1 Brunet, L.
A1 Albouy, A.
A1 Theodorou, C.
A1 Ribotta, M.
A1 Bosch, D.
A1 Ollier, E.
A1 Muller, D.
A1 Neyens, M.
A1 Jeanjean, D.
A1 Ferrotti, T.
A1 Mortini, E.
A1 Mattei, J.G.
A1 Inard, A.
A1 Fillon, R.
A1 Lalanne, F.
A1 Roy, F.
A1 Josse, E.
YR 2022
SN 2156-017X
K1 Performance evaluation
K1 Solid modeling
K1 Three-dimensional displays
K1 Scalability
K1 CMOS image sensors
K1 Acoustic measurements
K1 Acoustics
SP 37.4.1
OP 37.4.4
LK http://dx.doi.org/https://doi.org/10.1109/IEDM45625.2022.10019432
DO https://doi.org/10.1109/IEDM45625.2022.10019432
SF ELIB - SuUB Bremen

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