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1 Ergebnisse
1
Subtractive Ru Interconnect Enabled by Novel Patterning Sol..:
, In:
2022 International Electron Devices Meeting (IEDM)
,
Penny, C.
;
Motoyama, K.
;
Ghosh, S.
... - p. 12.1.1-12.1.4 , 2022
Link:
https://doi.org/10.1109/IEDM45625.2022.10019479
RT T1 <cTitle>2022 International Electron Devices Meeting (IEDM)</cTitle>: T1 <Title>Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10019479&Exemplar=1&LAN=DE A1 Penny, C. A1 Motoyama, K. A1 Ghosh, S. A1 Bae, T. A1 Lanzillo, N. A1 Sieg, S. A1 Park, C. A1 Zou, L. A1 Lee, H. A1 Metzler, D. A1 Lee, J. A1 Cho, S. A1 Shoudy, M. A1 Nguyen, S. A1 Simon, A. A1 Park, K. A1 Clevenger, L. A1 Anderson, B. A1 Child, C. A1 Yamashita, T. A1 Arnold, J. A1 Wu, T. A1 Spooner, T. A1 Choi, K. A1 Seo, K-I. A1 Guo, D. YR 2022 SN 2156-017X K1 Resistance K1 Metallization K1 Atmospheric modeling K1 Simulation K1 Current measurement K1 Conductors K1 Capacitance SP 12.1.1 OP 12.1.4 LK http://dx.doi.org/https://doi.org/10.1109/IEDM45625.2022.10019479 DO https://doi.org/10.1109/IEDM45625.2022.10019479 SF ELIB - SuUB Bremen
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