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1 Ergebnisse
1
Enabling Next Generation 3D Heterogeneous Integration Archi..:
, In:
2022 International Electron Devices Meeting (IEDM)
,
Elsherbini, A.
;
Jun, K.
;
Liff, S.
... - p. 27.3.1-27.3.4 , 2022
Link:
https://doi.org/10.1109/IEDM45625.2022.10019499
RT T1 <cTitle>2022 International Electron Devices Meeting (IEDM)</cTitle>: T1 <Title>Enabling Next Generation 3D Heterogeneous Integration Architectures on Intel Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10019499&Exemplar=1&LAN=DE A1 Elsherbini, A. A1 Jun, K. A1 Liff, S. A1 Talukdar, T. A1 Bielefeld, J. A1 Li, W. A1 Vreeland, R. A1 Niazi, H. A1 Rawlings, B. A1 Ajayi, T. A1 Tsunoda, N. A1 Hoff, T. A1 Woods, C. A1 Pasdast, G. A1 Tiagaraj, S. A1 Kabir, E. A1 Shi, Y. A1 Brezinski, W. A1 Jordan, R. A1 Ng, J. A1 Brun, X. A1 Krisnatreya, B. A1 Liu, P. A1 Zhang, B. A1 Qian, Z. A1 Goel, M. A1 Swan, J. A1 Yin, G. A1 Pelto, C. A1 Torres, J. A1 Fischer, P. YR 2022 SN 2156-017X K1 Three-dimensional displays K1 Optical imaging K1 Silicon K1 Hybrid power systems K1 Dielectrics K1 Optical films K1 Bonding SP 27.3.1 OP 27.3.4 LK http://dx.doi.org/https://doi.org/10.1109/IEDM45625.2022.10019499 DO https://doi.org/10.1109/IEDM45625.2022.10019499 SF ELIB - SuUB Bremen
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