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Hybrid Substrates for Chiplet Design and Heterogeneous Inte..:

, In: 2022 International Electron Devices Meeting (IEDM),
Lau, J. H. ; Chen, G. ; Yang, C.... - p. 3.5.1-3.5.4 , 2022
Link: https://doi.org/10.1109/IEDM45625.2022.10019568