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1 Ergebnisse
1
A Package on Package Assembly Method of SiP Microwave Modul..:
, In:
2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT)
,
Sun, Ruhao
;
Wang, Cheng
;
Wei, Wei
.. - p. 1-3 , 2022
Link:
https://doi.org/10.1109/ICMMT55580.2022.10023426
RT T1 <cTitle>2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT)</cTitle>: T1 <Title>A Package on Package Assembly Method of SiP Microwave Module based on Heteroid BGA Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10023426&Exemplar=1&LAN=DE A1 Sun, Ruhao A1 Wang, Cheng A1 Wei, Wei A1 Xie, Lu A1 Mao, Bingcheng YR 2022 K1 Microwave integrated circuits K1 System-in-package K1 Stacking K1 Millimeter wave technology K1 Metals K1 Microwave devices K1 Microwave theory and techniques K1 Package on package K1 system in package K1 ball grid array SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/ICMMT55580.2022.10023426 DO https://doi.org/10.1109/ICMMT55580.2022.10023426 SF ELIB - SuUB Bremen
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