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A titanium-based composite-type MEMS Pirani gauge for wafer..:

, In: 9th International Symposium on Test Automation & Instrumentation (ISTAI 2022),

Chen, S. ; Ji, Y. ; Feng, L.... - p. None , 2022

Link: https://doi.org/10.1049/icp.2022.3286

RT 
T1 <cTitle>9th International Symposium on Test Automation & Instrumentation (ISTAI 2022)</cTitle>: T1 <Title>A titanium-based composite-type MEMS Pirani gauge for wafer-level packaging</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10026706&Exemplar=1&LAN=DE
				
A1 Chen, S.
A1 Ji, Y.
A1 Feng, L.
A1 Guo, S.
A1 Peng, X.
A1 Xu, Y.
A1 Wang, S.
YR 2022
K1 composite materials
K1 computerised instrumentation
K1 microfabrication
K1 microsensors
K1 pressure gauges
K1 pressure measurement
K1 pressure sensors
K1 temperature measurement
K1 temperature sensors
K1 thermal conductivity measurement
K1 thermistors
K1 titanium
K1 wafer level packaging
K1 circuit simulation
K1 composite MEMS Pirani gauge device
K1 COMSOL Multiphysics
K1 encapsulation
K1 gas pressure measurement
K1 heating resistor
K1 NI Multisim
K1 titanium-based composite-type MEMS Pirani gauge
K1 vacuum sensor
SP None
LK http://dx.doi.org/https://doi.org/10.1049/icp.2022.3286
DO https://doi.org/10.1049/icp.2022.3286
SF ELIB - SuUB Bremen

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