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1 Ergebnisse
1
A Study on Alternative Substrate for FCBGA:
, In:
2022 IEEE CPMT Symposium Japan (ICSJ)
,
Hung, Li-Chieh
;
Wu, Po-I
;
Kuo, Hung-Chun
... - p. 134-137 , 2022
Link:
https://doi.org/10.1109/ICSJ55786.2022.10034688
RT T1 <cTitle>2022 IEEE CPMT Symposium Japan (ICSJ)</cTitle>: T1 <Title>A Study on Alternative Substrate for FCBGA</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10034688&Exemplar=1&LAN=DE A1 Hung, Li-Chieh A1 Wu, Po-I A1 Kuo, Hung-Chun A1 Jhong, Ming-Fong A1 Wang, Chen-Chao A1 Wang, Si-Min YR 2022 SN 2475-8418 K1 Fans K1 Costs K1 Flip-chip devices K1 Substrates K1 Signal integrity K1 Consumer electronics K1 Electronics packaging K1 FCBGA K1 Coreless substrate K1 FOCoS K1 Power integrity SP 134 OP 137 LK http://dx.doi.org/https://doi.org/10.1109/ICSJ55786.2022.10034688 DO https://doi.org/10.1109/ICSJ55786.2022.10034688 SF ELIB - SuUB Bremen
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