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1
Finite Element Method for System-in-Package (SiP) Technolog..:
, In:
2023 17th International Conference on Ubiquitous Information Management and Communication (IMCOM)
,
Oukaira, Aziz
;
Said, Dhaou
;
Zbitou, Jamal
. - p. 1-5 , 2023
Link:
https://doi.org/10.1109/IMCOM56909.2023.10035652
RT T1 <cTitle>2023 17th International Conference on Ubiquitous Information Management and Communication (IMCOM)</cTitle>: T1 <Title>Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10035652&Exemplar=1&LAN=DE A1 Oukaira, Aziz A1 Said, Dhaou A1 Zbitou, Jamal A1 Lakhssassi, Ahmed YR 2023 K1 Heating systems K1 Temperature distribution K1 Analytical models K1 System-in-package K1 Packaging K1 Thermal conductivity K1 Thermal management K1 Chip-Cooling-Laminate-Chip (CCLC) K1 FEM K1 SiP K1 thermal management SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/IMCOM56909.2023.10035652 DO https://doi.org/10.1109/IMCOM56909.2023.10035652 SF ELIB - SuUB Bremen
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