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1 Ergebnisse
1
A 42.24 Gb/s Channel Bonding Up-Converter with integrated m..:
, In:
2023 IEEE 23rd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
,
Siligaris, A.
;
Courouve, P.
;
Waltener, G.
... - p. 4-7 , 2023
Link:
https://doi.org/10.1109/SiRF56960.2023.10046233
RT T1
2023 IEEE 23rd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
: T1
A 42.24 Gb/s Channel Bonding Up-Converter with integrated multi-LO generation in 45nm CMOS
UL https://suche.suub.uni-bremen.de/peid=ieee-10046233&Exemplar=1&LAN=DE A1 Siligaris, A. A1 Courouve, P. A1 Waltener, G. A1 Hamani, A. A1 Dehos, C. A1 Gonzalez-Jimenez, J. L. YR 2023 SN 2474-9761 K1 Radio frequency K1 Frequency modulation K1 Channel spacing K1 Monolithic integrated circuits K1 Frequency conversion K1 CMOS technology K1 Energy efficiency K1 V-band K1 channel bonding K1 high data rate K1 64-QAM K1 LO generation K1 CMOS 45nm SP 4 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/SiRF56960.2023.10046233 DO https://doi.org/10.1109/SiRF56960.2023.10046233 SF ELIB - SuUB Bremen
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