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1 Ergebnisse
1
Chiplet Heterogeneous-Integration AI Processor:
, In:
2023 International Conference on Electronics, Information, and Communication (ICEIC)
,
Kwon, Youngsu
;
Han, Jinho
;
Cho, Yongcheol Peter
... - p. 1-2 , 2023
Link:
https://doi.org/10.1109/ICEIC57457.2023.10049867
RT T1
2023 International Conference on Electronics, Information, and Communication (ICEIC)
: T1
Chiplet Heterogeneous-Integration AI Processor
UL https://suche.suub.uni-bremen.de/peid=ieee-10049867&Exemplar=1&LAN=DE A1 Kwon, Youngsu A1 Han, Jinho A1 Cho, Yongcheol Peter A1 Kim, Juyeob A1 Chung, Jaehoon A1 Choi, Jaewoong A1 Park, Sujin A1 Kim, Igyeong A1 Kwon, Hyunjeong A1 Kim, Jinkyu A1 Kim, Hyunmi A1 Jeon, Won A1 Jeon, Youngdeuk A1 Cho, Minhyung A1 Choi, Minseok YR 2023 SN 2767-7699 K1 Costs K1 Computer architecture K1 Reliability engineering K1 Explosions K1 Stability analysis K1 Thermal analysis K1 Performance analysis K1 chiplets K1 AI K1 processor K1 interposer K1 heterogeneous integration K1 2.5D integration K1 3D integration SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/ICEIC57457.2023.10049867 DO https://doi.org/10.1109/ICEIC57457.2023.10049867 SF ELIB - SuUB Bremen
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