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Metallic/magnetic Multilayer for Wide-band Direct-on-chip E..:

, In: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI),
Kikitsu, A. ; Kurosaki, Y. ; Shirotori, S.... - p. 643-644 , 2022
Link: https://doi.org/10.1109/EMCSI39492.2022.10050239