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1 Ergebnisse
1
Robust Polycrystalline 3C-Sic-on-Si Heterostructures with L..:
, In:
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
,
Moll, Philipp
;
Pfusterschmied, Georg
;
Schmid, Ulrich
- p. 590-593 , 2023
Link:
https://doi.org/10.1109/MEMS49605.2023.10052144
RT T1
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
: T1
Robust Polycrystalline 3C-Sic-on-Si Heterostructures with Low CTE Mismatch up to 900 °C for MEMS
UL https://suche.suub.uni-bremen.de/peid=ieee-10052144&Exemplar=1&LAN=DE A1 Moll, Philipp A1 Pfusterschmied, Georg A1 Schmid, Ulrich YR 2023 SN 2160-1968 K1 Micromechanical devices K1 Temperature measurement K1 Vibrations K1 Temperature sensors K1 Thermal expansion K1 Fluid flow K1 Silicon K1 3C-SiC K1 LPCVD K1 CTE mismatch K1 thermal stress SP 590 OP 593 LK http://dx.doi.org/https://doi.org/10.1109/MEMS49605.2023.10052144 DO https://doi.org/10.1109/MEMS49605.2023.10052144 SF ELIB - SuUB Bremen
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