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A Transfer Method for Embedding Conductive Fillers on the S..:

, In: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS),
Yoo, Dongwoo ; Kim, Sangmok ; Hwang, Jeonghyeon. - p. 327-330 , 2023
Link: https://doi.org/10.1109/MEMS49605.2023.10052193