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1 Ergebnisse
1
A Performance Enhancement Method for Thermopile Sensors Usi..:
, In:
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
,
Shi, Meng
;
Li, Mao
;
Ni, Yue
... - p. 582-585 , 2023
Link:
https://doi.org/10.1109/MEMS49605.2023.10052327
RT T1 <cTitle>2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)</cTitle>: T1 <Title>A Performance Enhancement Method for Thermopile Sensors Using a Chip Probe Test System</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10052327&Exemplar=1&LAN=DE A1 Shi, Meng A1 Li, Mao A1 Ni, Yue A1 Zhang, Chenchen A1 Zhou, Na A1 Mao, Haiyang A1 Huang, Chengjun YR 2023 SN 2160-1968 K1 Performance evaluation K1 Temperature sensors K1 Printing K1 Micromechanical devices K1 Temperature distribution K1 Absorption K1 Process control K1 Thermopile sensors K1 chip probe (CP) test K1 ink dots K1 optical absorption enhancement SP 582 OP 585 LK http://dx.doi.org/https://doi.org/10.1109/MEMS49605.2023.10052327 DO https://doi.org/10.1109/MEMS49605.2023.10052327 SF ELIB - SuUB Bremen
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