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1 Ergebnisse
1
Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonat..:
, In:
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
,
Sun, Baoyun
;
Mo, Jiarui
;
Zhang, Hemin
... - p. 621-624 , 2023
Link:
https://doi.org/10.1109/MEMS49605.2023.10052401
RT T1
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
: T1
Silicon Carbide-on-Insulator Thermal-Piezoresistive Resonator for Harsh Environment Application
UL https://suche.suub.uni-bremen.de/peid=ieee-10052401&Exemplar=1&LAN=DE A1 Sun, Baoyun A1 Mo, Jiarui A1 Zhang, Hemin A1 van Zeijl, Henk W. A1 van Driel, Willem D. A1 Zhang, Guoqi YR 2023 SN 2160-1968 K1 Fabrication K1 Resistance K1 Micromechanical devices K1 Temperature K1 Current-voltage characteristics K1 Resonant frequency K1 Silicon K1 Silicon carbide-on-insulator K1 thermal-piezoresistive K1 resonator K1 harsh environment SP 621 OP 624 LK http://dx.doi.org/https://doi.org/10.1109/MEMS49605.2023.10052401 DO https://doi.org/10.1109/MEMS49605.2023.10052401 SF ELIB - SuUB Bremen
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