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1 Ergebnisse
1
Hierarchical Bonding Yield Test Structure for Flexible High..:
, In:
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
,
Odenthal, Marie C.
;
Claar, Victor
;
Paul, Oliver
. - p. 409-412 , 2023
Link:
https://doi.org/10.1109/MEMS49605.2023.10052500
RT T1
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
: T1
Hierarchical Bonding Yield Test Structure for Flexible High Channel-Count Neural Probes Interfacing ASIC Chips
UL https://suche.suub.uni-bremen.de/peid=ieee-10052500&Exemplar=1&LAN=DE A1 Odenthal, Marie C. A1 Claar, Victor A1 Paul, Oliver A1 Ruther, Patrick YR 2023 SN 2160-1968 K1 Micromechanical devices K1 Gold K1 Semiconductor device measurement K1 Contacts K1 Force K1 Polyimides K1 Silicon K1 Hybrid integration K1 flexible neural probes K1 flip-chip bonding K1 process development SP 409 OP 412 LK http://dx.doi.org/https://doi.org/10.1109/MEMS49605.2023.10052500 DO https://doi.org/10.1109/MEMS49605.2023.10052500 SF ELIB - SuUB Bremen
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