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1 Ergebnisse
1
Failure Analysis of Dielectric Material Defects Inside IGBT..:
, In:
2022 4th International Conference on System Reliability and Safety Engineering (SRSE)
,
Jian, Zhou
;
Jiesen, Li
;
Zongbei, Dai
.. - p. 421-424 , 2022
Link:
https://doi.org/10.1109/SRSE56746.2022.10067417
RT T1 <cTitle>2022 4th International Conference on System Reliability and Safety Engineering (SRSE)</cTitle>: T1 <Title>Failure Analysis of Dielectric Material Defects Inside IGBT Chips</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10067417&Exemplar=1&LAN=DE A1 Jian, Zhou A1 Jiesen, Li A1 Zongbei, Dai A1 Qian, Shi A1 Shaohua, Yang YR 2022 K1 Insulated gate bipolar transistors K1 Partial discharges K1 Dielectric materials K1 Failure analysis K1 Moisture K1 Materials reliability K1 Dielectrics K1 IGBT chips K1 dielectric material defects K1 failure analysis SP 421 OP 424 LK http://dx.doi.org/https://doi.org/10.1109/SRSE56746.2022.10067417 DO https://doi.org/10.1109/SRSE56746.2022.10067417 SF ELIB - SuUB Bremen
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