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1 Ergebnisse
1
A 3-Wafer-Stacked Hybrid 15MPixel CIS + 1 MPixel EVS with 4..:
, In:
2023 IEEE International Solid- State Circuits Conference (ISSCC)
,
Guo, Menghan
;
Chen, Shoushun
;
Gao, Zhe
... - p. 90-92 , 2023
Link:
https://doi.org/10.1109/ISSCC42615.2023.10067476
RT T1 <cTitle>2023 IEEE International Solid- State Circuits Conference (ISSCC)</cTitle>: T1 <Title>A 3-Wafer-Stacked Hybrid 15MPixel CIS + 1 MPixel EVS with 4.6GEvent/s Readout, In-Pixel TDC and On-Chip ISP and ESP Function</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10067476&Exemplar=1&LAN=DE A1 Guo, Menghan A1 Chen, Shoushun A1 Gao, Zhe A1 Yang, Wenlei A1 Bartkovjak, Peter A1 Qin, Qing A1 Hu, Xiaoqin A1 Zhou, Dahei A1 Uchiyama, Masayuki A1 Kudo, Yoshiharu A1 Fukuoka, Shimpei A1 Xu, Chengcheng A1 Ebihara, Hiroaki A1 Wang, Andy A1 Jiang, Peiwen A1 Jiang, Bo A1 Mu, Bo A1 Chen, Huan A1 Yang, Jason A1 Dai, TJ A1 Suess, Andreas YR 2023 SN 2376-8606 K1 Three-dimensional displays K1 Vision sensors K1 CMOS image sensors K1 System-on-chip K1 Object tracking K1 Low latency communication SP 90 OP 92 LK http://dx.doi.org/https://doi.org/10.1109/ISSCC42615.2023.10067476 DO https://doi.org/10.1109/ISSCC42615.2023.10067476 SF ELIB - SuUB Bremen
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