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A 4nm 32Gb/s 8Tb/s/mm Die-to-Die Chiplet Using NRZ Single-E..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Seong, Kihwan ; Park, Donguk ; Bae, Gyeomje... - p. 114-116 , 2023
Link: https://doi.org/10.1109/ISSCC42615.2023.10067477