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1 Ergebnisse
1
Analysis of the Impact of Chip Failures in Different Positi..:
, In:
2022 3rd International Conference on Advanced Electrical and Energy Systems (AEES)
,
Wang, Zhaoyun
;
Zhang, Qingping
;
Yang, Kai
... - p. 176-180 , 2022
Link:
https://doi.org/10.1109/AEES56284.2022.10079568
RT T1 <cTitle>2022 3rd International Conference on Advanced Electrical and Energy Systems (AEES)</cTitle>: T1 <Title>Analysis of the Impact of Chip Failures in Different Positions of Press-Pack IGBTs on other Chips</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10079568&Exemplar=1&LAN=DE A1 Wang, Zhaoyun A1 Zhang, Qingping A1 Yang, Kai A1 Kang, Yongqiang A1 Li, Shuaibing A1 Li, Hongwei YR 2022 K1 Insulated gate bipolar transistors K1 Temperature distribution K1 Analytical models K1 Predictive models K1 Boundary conditions K1 Finite element analysis K1 Current density K1 press-pack IGBTs K1 chip failure K1 temperature K1 current density K1 life span SP 176 OP 180 LK http://dx.doi.org/https://doi.org/10.1109/AEES56284.2022.10079568 DO https://doi.org/10.1109/AEES56284.2022.10079568 SF ELIB - SuUB Bremen
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