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1 Ergebnisse
1
A 128 Gbit/s 3D-Integrated Silicon Photonics Receiver with ..:
, In:
2022 Asia Communications and Photonics Conference (ACP)
,
Wu, Dingyi
;
Wang, Dong
;
Chen, Daigao
... - p. 1509-1513 , 2022
Link:
https://doi.org/10.1109/ACP55869.2022.10088619
RT T1
2022 Asia Communications and Photonics Conference (ACP)
: T1
A 128 Gbit/s 3D-Integrated Silicon Photonics Receiver with 1.5 pJ/bit Power Consumption
UL https://suche.suub.uni-bremen.de/peid=ieee-10088619&Exemplar=1&LAN=DE A1 Wu, Dingyi A1 Wang, Dong A1 Chen, Daigao A1 Yan, Jie A1 Dang, Ziyue A1 Feng, Jianchao A1 Chen, Shiping A1 Feng, Peng A1 Zhang, Hongguang A1 Fu, Yanfeng A1 Wang, Lei A1 Hu, Xiao A1 Xiao, Xi YR 2022 K1 Power demand K1 Three-dimensional displays K1 Receivers K1 Bandwidth K1 Silicon photonics K1 Photodetectors K1 Flip-chip devices K1 3D Integration K1 Ge-Si Photodetector K1 TIA K1 Flip-chip technology SP 1509 OP 1513 LK http://dx.doi.org/https://doi.org/10.1109/ACP55869.2022.10088619 DO https://doi.org/10.1109/ACP55869.2022.10088619 SF ELIB - SuUB Bremen
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