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1 Ergebnisse
1
Damage Assessment Structure of Thermal-Annealing Post-Proce..:
, In:
2023 35th International Conference on Microelectronic Test Structure (ICMTS)
,
Okamoto, Yuki
;
Makimoto, Natsumi
;
Misumi, Kei
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICMTS55420.2023.10094159
RT T1 <cTitle>2023 35th International Conference on Microelectronic Test Structure (ICMTS)</cTitle>: T1 <Title>Damage Assessment Structure of Thermal-Annealing Post-Processing on CMOS LSIs</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10094159&Exemplar=1&LAN=DE A1 Okamoto, Yuki A1 Makimoto, Natsumi A1 Misumi, Kei A1 Kobayashi, Takeshi A1 Mita, Yoshio A1 Ichiki, Masaaki YR 2023 SN 2158-1029 K1 Ring oscillators K1 Wiring K1 Degradation K1 MOSFET K1 Annealing K1 Temperature K1 Monolithic integrated circuits K1 CMOS post-process K1 thermal budget K1 PZT K1 damage assessment SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICMTS55420.2023.10094159 DO https://doi.org/10.1109/ICMTS55420.2023.10094159 SF ELIB - SuUB Bremen
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