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Design of Power Modules Using Containers Filled With Phase ..:
, In:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Khazaka, Rabih
;
Avenas, Yvan
;
Hanna, Rachelle
. - p. 1-6 , 2023
Link:
https://doi.org/10.1109/EuroSimE56861.2023.10100726
RT T1
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
: T1
Design of Power Modules Using Containers Filled With Phase Change Materials as Device Top Interconnection for Power Peak Management
UL https://suche.suub.uni-bremen.de/peid=ieee-10100726&Exemplar=1&LAN=DE A1 Khazaka, Rabih A1 Avenas, Yvan A1 Hanna, Rachelle A1 Azzopardi, Stephane YR 2023 SN 2833-8596 K1 Phase change materials K1 Cooling K1 Wires K1 Multichip modules K1 Containers K1 Sugar industry K1 Copper SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE56861.2023.10100726 DO https://doi.org/10.1109/EuroSimE56861.2023.10100726 SF ELIB - SuUB Bremen
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